PCB Stackup Manufacture

10 May 2016
PCB Stackup Design

Our standard multi-layer PCB stackup is predominantly made up of three components with varying thicknesses of Copper Foil, Pre-preg and Copper clad FR4 laminates as cores.

Copper Thickness

The Standard Copper thickness in particular for all the FR4 Core Inner Layers is generally 35um (1oz), this can be easily varied to 18um (0.5oz) – 70um (2oz) – 105um (3oz) if required.

Increasing the Copper thickness to 70um or Higher will naturally depend on the printed circuit board design in respect to Trace/Space clearances.

Multi-layer Stackups

All our Standard Multi-layer Stackups can be varied and detailed to suit not only specific finished thicknesses but more importantly specific calculated impedance control requirements for RF applications.

Contact the Stackup Experts

If you have a special requirement for a finished thickness or impedance please email us the details and we can recommend a multi-layer stack up to suit.

We offer these FR4 laminates and pre-preg’s in standard TG materials – TG=130/140 as well high TG materials TG=170:

Please Contact Us for more detailed information.

Materials4-layer PCB 6-layer PCB8-layer PCB10-layer PCB12-layer PCB14-layer PCB16-layer PCB18-layer PCB20-layer PCB

why choose us

Synergy Electronics mission is to provide total customer satisfaction in PCB prototypes and manufacturing through cooperative interaction and service.

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